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Military & Aerospace Electronics May 2007 John Keller	Temperature's Rising: Designers Face Myriad Options to Cool Electronic Systems More electronic and electro-optic systems mean more electric power, and increasing heat that engineers must get rid of. Today's choices include convection, conduction, and liquid-cooling options. Tomorrow's choices will be more complex.
Military & Aerospace Electronics April 2009 Courtney E. Howard	Thinking Inside the Box Systems engineers and technology firms partner to equip mil-aero platforms with innovative enclosures, backplanes, and electronics packaging.
Military & Aerospace Electronics May 2009 J.R. Wilson	Electronic thermal management is heading to the wall Systems designers who are used to boosting electronic system performance by adding ever-more transistors may have to rethink their design approaches.
Military & Aerospace Electronics April 2008 Courtney E. Howard	Thermal Management Targets the Enemy of Electronics: Excessive Heat Heat threatens the longevity and performance of electronics, especially vehicular electronics (vetronics), in military-aero environments.
Military & Aerospace Electronics May 2006 J.R. Wilson	The great cooling dilemma: conduction, convection, or liquid Today's most advanced cooling technologies are starting to take center stage.
Military & Aerospace Electronics April 2008 Courtney E. Howard	Thermal Management a Challenge for Designers of Future Military Aircraft Today's aviation, vetronics, and other military-aero applications require more power, but have less space. This contributes to higher thermal loads and less opportunity to drive the heat out.
Military & Aerospace Electronics February 2007 John McHale	Thermal-management challenges highlight Military Technologies Conference 2007 U.S. Department of Defense and industry experts to discuss thermal and power management at the Military Technologies Conference (March 27 and 28, 2007) in Boston.
Military & Aerospace Electronics September 2005 Ram Rajan	Solving thermal-management challenges in military and aerospace applications Higher system performance -- often coupled with faster and hotter processors, and denser packaging -- can be two major nemeses for the chassis designer.
Military & Aerospace Electronics January 2006 Randy Banton	Evolving COTS cooling for military environments A new 6U infrastructure for air cooling and conduction cooling which is extensible to 3U systems, spray-cooling and liquid-flow-through cooling systems, will enable broader use of commercial off-the-shelf systems.
Military & Aerospace Electronics April 2009	Carlo Gavazzi Introduces Rugged Air-Cooled Enclosures for Avionics and Vetronics Applications Carlo Gavazzi is introducing a series of re-circulating air-cooled rugged ATR enclosures for commercial off-the-shelf (COTS) printed circuit boards for extreme temperature, vibration, humidity, and contaminants.
Military & Aerospace Electronics May 2008 Michael R. Palis	Advances in thermal management techniques for chassis design A new approach to thermal management involves separating the ambient environment and the operating electronics to keep out contaminants. A convenient way to do this is using compact air-to-air heat exchangers.
Military & Aerospace Electronics July 2009	Parker Offers Liquid Cooling for High-Power Electronic Thermal Management Parker Hannifin is introducing a two-phase liquid cooling system for electronic thermal management and heat removal from high-power electronics.
Military & Aerospace Electronics July 2005 John Keller	Is cooling the central design issue of our time? The pace of improvements in integrated circuitry is outstripping our ability to remove unwanted heat. And engineers are starting to quip about some of the dilemmas that new cooling approaches may create.
Military & Aerospace Electronics September 2009 Courtney E. Howard	Advanced Vetronics: Hit the Ground Running Industry heeds the warfighter's call for innovative, responsive, and reliable electronics in combat vehicles on the ground.
Military & Aerospace Electronics July 2007 Ben Kuster	CFD Analysis Delivers Impressive Savings for Electronics Thermal Design Computational-fluid-dynamics software is an invaluable thermal-analysis weapon for the electronics design arsenal. At VT Miltope Corp., it saves weeks of development time and thousands of development dollars-even on small projects.
Military & Aerospace Electronics September 2008 Courtney E. Howard	A Voracious Need for Vectronics Military end users have an increasing demand for computing and networking performance in packages that are ever smaller, lighter, and more power efficient
Military & Aerospace Electronics May 2009	CSPI selects SprayCool cooling for deployments in harsh environments Engineers at CSP Inc.'s MultiComputer Division, a supplier of rugged embedded clusters in San Diego, needed a thermal management system for their company's FastCluster product line.
Military & Aerospace Electronics January 2010 Courtney E. Howard	By Land, by Sea, by Air: Rugged Computers Are Everywhere Military and aerospace organizations around the world tap novel rugged mobile computers for mission-critical applications.
Military & Aerospace Electronics March 2008 John McHale	Managing Thermal Efficiency of Modern Processors Discussed at Military & Aerospace Electronics Forum Current and future-generation processors are creating escalating thermal demands on military designers.
Military & Aerospace Electronics December 2006 John Keller	Demands for High Power and Optimum Size Drive Some Power-Supply Makers Away From Traditional COTS Solutions Moore's Law is placing a set of increasingly crushing demands on power-component makers who must feed the right amounts of electricity to the latest generations of microprocessor behemoths.
Military & Aerospace Electronics December 2005 John McHale	ISR to Develop System for Thermal Management on Aging Military Aircraft Engineers at ISR, are developing next-generation common thermal-management systems for the U.S. Air Force current and future aircraft.
Military & Aerospace Electronics August 2006 John McHale	Purdue Researchers Look at Nanotechnology to Reduce Computer-Chip Heating University researchers are looking to mitigate electronic systems heating problems through the use of carbon nanotubes. They have created carpets of microscopic nanotubes to enhance the performance of heat sinks to help keep future chips from overheating.
Military & Aerospace Electronics June 2005 John McHale	Purdue Researchers Create Miniature Cooling Device Mechanical engineers have developed techniques for modifying household refrigeration technology with small devices to cool future weapons systems and computer chips.
Military & Aerospace Electronics January 2008 Courtney E. Howard	Rugged Electronics Empower Tomorrow's Technology Technology companies enable our military's net-centric vision through smaller, faster, stronger computers.
Military & Aerospace Electronics May 2008 Courtney E. Howard	Military programs adopt SprayCool liquid-cooled electronics enclosure for harsh environments The EFV is designed to assist Marines in combat by making the most of tactical surprise, minimizing vulnerability on land, and improving firepower, lethality, and survivability.
Military & Aerospace Electronics March 2010 Courtney E. Howard	Empowering embedded computing Mainstream, COTS technologies combine with aerospace and defense industry innovations to deliver increased performance in compact electronics designs
IndustryWeek February 1, 2004 John Teresko	Helping Electronics Keep Their Cool New thermal-management technology doesn't need cooling fans, say Georgia Tech researchers.
Military & Aerospace Electronics August 2009	SprayCool Offers 3U Rackmount Chassis with Liquid Cooling for Avionics and Vetronics The 3U rugged enclosure is designed for armored vehicle vetronics, and aircraft avionics that require small, lightweight, low-power, and low-cost military embedded aerospace electronics.
Military & Aerospace Electronics May 2007 John Keller	Through with Hydraulics? Think Again Opportunity for leaks, outright breaks, clogs, and the weight of liquid and pipe have led aircraft designers to search for a way to eliminate hydraulic systems. Electric systems looked promising, but now it's back to the drawing board.
Military & Aerospace Electronics January 2006 Ben Ames	Rugged Computers Power the Digital Battlefield Troops are pushing rugged computers harder than ever, as manufacturers seek tougher display screens, more reliable hard drives, and faster processors. A major challenge for engineers is to keep pace with fast upgrades in COTS technology.
Military & Aerospace Electronics December 2007 John Keller	Cost-Sensitive Military Pressures Power Supply Makers to Shrink and Ruggedize COTS Devices Manufacturers of power electronics for military and aerospace applications say they are under pressure to shrink device size and keep a lid on prices, as well as to ruggedize and integrate off-the-shelf components.
Military & Aerospace Electronics February 2008	Nextreme Offers Electro-Optics and Microelectronics Cooler for Military Applications Nextreme Thermal Solutions is introducing the Ultra-High Packing Fraction (UPF) OptoCooler thermoelectric module for cooling and temperature-control requirements for electronics, medical, military, and aerospace applications.
The Motley Fool October 30, 2006 Jack Uldrich	IBM to Chips: Cool It! Big Blue's new chip-cooling technique could keep Moore's Law on track. IBM's system, while not yet ready for commercial production, is reportedly so efficient that officials expect it will double cooling efficiency.
Military & Aerospace Electronics November 2007 John McHale	Purdue Researchers Demonstrate New Chip-Cooling Technology Researchers are taking a new approach with a new technology that uses tiny ionic wind engines that they say might dramatically improve computer chip cooling-a constant challenge for military and commercial electronics designers.
IEEE Spectrum November 2008 Monica Heger	IBM Tests Heating Homes With Data-Center Waste Heat Cooling computers with hot water is a step toward zero-emission data centers
BusinessWeek October 4, 2004 Stephen H. Wildstrom	Those Superfast Chips: Too Darn Hot Cooling today's fastest chips is becoming a challenge in even the biggest desktop towers.
IEEE Spectrum January 2009 Willie D. Jones	Intel-led Team Demonstrates First Chip-Scale Thermoelectric Refrigerator An integrated thermoelectric device cools a hot spot on a much larger chip
Military & Aerospace Electronics May 2008	Products Martek Power offers high-power, multichannel power modules... Aeroflex offers Battery Electronic Unit family of Li-Ion cell balancing products... Elmo offers board-mounted servo drive with 5 kilowatts continuous power... etc.
Military & Aerospace Electronics December 2005 Powers & Penglase	Using DC-DC Converters in Mobile-Based Ground Equipment As designers incorporate increasing amounts of sophisticated electronics into industrial and military vehicle-based applications, high-density DC-DC converters have evolved to keep pace.
Military & Aerospace Electronics July 2006	Standards-Based Technology Liquid Cooling Parker Hannifin built an advanced standards-based technology liquid cooling demonstrator for high-power embedded electronics applications to support manufacturers and users of open-system architectures.
Military & Aerospace Electronics January 2010	Microelectronics Thermal Management Device From Nextreme Meets MIL-STD 883 Shock Standard An advanced heat-pumping thermoelectric device for electronics thermal management from Nextreme Thermal Solutions has passed the 3000-G shock test as defined in the 2002 mechanical shock standard.
Military & Aerospace Electronics April 2009 Tom Litrenta	Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50 Percent Early thermal simulations helped C-MAC MicroTechnology discovered that junction temperatures on a stacked module ranged up to 125 degrees and needed increased thermal resistance.
InternetNews August 15, 2007 Andy Patrizio	A Mighty Wind's a Blowin' at Purdue Researchers at Purdue University have developed a new method of semiconductor cooling that could improve the cooling rate inside computers by as much as 250 percent.
Military & Aerospace Electronics April 2006 John Keller	The Future Has a Name: VITA 58 A new electronics packaging standard continues to take shape that has the potential to revolutionize military and aerospace systems like no standard ever has before.
Military & Aerospace Electronics April 2006	Heat Sinks for Low-Airflow Conditions Advanced Thermal Solutions has introduced maxiFLOW heat sinks for cooling ball grid arrays and other hot components in the restricted air flow conditions typical of today's condensed electronic packages.
Military & Aerospace Electronics June 2009 Courtney E. Howard	Electronics miniaturization Nanotechnology and MEMS are ideal for mil-aero applications, given the increasing need for small, light weight, and low-power solutions.
Food Engineering January 10, 2006	Air heat exchanger Air/air heat exchanger provides cooling and environmental protection in industrial enclosures requiring internal cabinet cooling using ambient air.
InternetNews July 7, 2010	IBM Testing Hot Water to Cool Servers IBM researchers in Switzerland are standing server cooling on its head, using water as warm as 140 degrees to cool processors that have an unusually high safe operating temperature.
Military & Aerospace Electronics October 2005	Method of heat removal is critical in design Far too often cooling is an afterthought in the design of the latest "black box" and by the time it is parameters such as power, volume, and weight are all at a premium.
Home Toys December 2004 Frank Federman	Cooling the Mid-Size Enclosure The audio and video components inside this size cabinet will have very little (meaning "no") ventilation unless the designer or installer "makes it happen."