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Military & Aerospace Electronics
May 2009
J.R. Wilson
Electronic thermal management is heading to the wall Systems designers who are used to boosting electronic system performance by adding ever-more transistors may have to rethink their design approaches. mark for My Articles similar articles
Military & Aerospace Electronics
May 2006
J.R. Wilson
The great cooling dilemma: conduction, convection, or liquid Today's most advanced cooling technologies are starting to take center stage. mark for My Articles similar articles
Military & Aerospace Electronics
May 2007
John Keller
Temperature's Rising: Designers Face Myriad Options to Cool Electronic Systems More electronic and electro-optic systems mean more electric power, and increasing heat that engineers must get rid of. Today's choices include convection, conduction, and liquid-cooling options. Tomorrow's choices will be more complex. mark for My Articles similar articles
Military & Aerospace Electronics
May 2008
Courtney E. Howard
Hot components and cool enclosures Systems architects and integrators are tackling the issues of military electronics survivability with clever chassis designs. mark for My Articles similar articles
Military & Aerospace Electronics
July 2005
John Keller
Is cooling the central design issue of our time? The pace of improvements in integrated circuitry is outstripping our ability to remove unwanted heat. And engineers are starting to quip about some of the dilemmas that new cooling approaches may create. mark for My Articles similar articles
Military & Aerospace Electronics
July 2009
Parker Offers Liquid Cooling for High-Power Electronic Thermal Management Parker Hannifin is introducing a two-phase liquid cooling system for electronic thermal management and heat removal from high-power electronics. mark for My Articles similar articles
Military & Aerospace Electronics
June 2005
John McHale
Purdue Researchers Create Miniature Cooling Device Mechanical engineers have developed techniques for modifying household refrigeration technology with small devices to cool future weapons systems and computer chips. mark for My Articles similar articles
IndustryWeek
February 1, 2004
John Teresko
Helping Electronics Keep Their Cool New thermal-management technology doesn't need cooling fans, say Georgia Tech researchers. mark for My Articles similar articles
Military & Aerospace Electronics
May 2007
John Keller
Through with Hydraulics? Think Again Opportunity for leaks, outright breaks, clogs, and the weight of liquid and pipe have led aircraft designers to search for a way to eliminate hydraulic systems. Electric systems looked promising, but now it's back to the drawing board. mark for My Articles similar articles
Military & Aerospace Electronics
April 2006
Heat Sinks for Low-Airflow Conditions Advanced Thermal Solutions has introduced maxiFLOW heat sinks for cooling ball grid arrays and other hot components in the restricted air flow conditions typical of today's condensed electronic packages. mark for My Articles similar articles
Fast Company
Daniel Terdiman
IBM: Data Centers Could Cool Themselves With Their Own Waste Heat The centers, which use tremendous amounts of energy, will become far more efficient if "waste heat" generated by churning data centers can be converted into cool air. mark for My Articles similar articles
Military & Aerospace Electronics
March 2006
Heat Sinks Deliver High Performance in Low-Airflow Conditions Advanced Thermal Solutions is offering maxiFLOW heat sinks for cooling ball grid arrays (BGAs) and other hot components in restricted air-flow conditions. mark for My Articles similar articles
Military & Aerospace Electronics
August 2006
John McHale
Purdue Researchers Look at Nanotechnology to Reduce Computer-Chip Heating University researchers are looking to mitigate electronic systems heating problems through the use of carbon nanotubes. They have created carpets of microscopic nanotubes to enhance the performance of heat sinks to help keep future chips from overheating. mark for My Articles similar articles
Military & Aerospace Electronics
April 2009
Courtney E. Howard
Thinking Inside the Box Systems engineers and technology firms partner to equip mil-aero platforms with innovative enclosures, backplanes, and electronics packaging. mark for My Articles similar articles
Military & Aerospace Electronics
July 2007
Ben Kuster
CFD Analysis Delivers Impressive Savings for Electronics Thermal Design Computational-fluid-dynamics software is an invaluable thermal-analysis weapon for the electronics design arsenal. At VT Miltope Corp., it saves weeks of development time and thousands of development dollars-even on small projects. mark for My Articles similar articles
This Old House
November 2007
Max Alexander
Geothermal Heat Pump For the ultimate in comfort and energy conservation, start by digging a hole. mark for My Articles similar articles
Scientific American
October 2008
Steven Ashley
Cool Polymers: Toward the Microwave Oven Version of the Refrigerator Getting a bigger chill out of polymers that respond to electric fields. mark for My Articles similar articles
Military & Aerospace Electronics
December 2005
Powers & Penglase
Using DC-DC Converters in Mobile-Based Ground Equipment As designers incorporate increasing amounts of sophisticated electronics into industrial and military vehicle-based applications, high-density DC-DC converters have evolved to keep pace. mark for My Articles similar articles
IEEE Spectrum
January 2009
Willie D. Jones
Intel-led Team Demonstrates First Chip-Scale Thermoelectric Refrigerator An integrated thermoelectric device cools a hot spot on a much larger chip mark for My Articles similar articles
Military & Aerospace Electronics
January 2006
Randy Banton
Evolving COTS cooling for military environments A new 6U infrastructure for air cooling and conduction cooling which is extensible to 3U systems, spray-cooling and liquid-flow-through cooling systems, will enable broader use of commercial off-the-shelf systems. mark for My Articles similar articles
Military & Aerospace Electronics
September 2005
Ram Rajan
Solving thermal-management challenges in military and aerospace applications Higher system performance -- often coupled with faster and hotter processors, and denser packaging -- can be two major nemeses for the chassis designer. mark for My Articles similar articles
Military & Aerospace Electronics
April 2008
Courtney E. Howard
Thermal Management Targets the Enemy of Electronics: Excessive Heat Heat threatens the longevity and performance of electronics, especially vehicular electronics (vetronics), in military-aero environments. mark for My Articles similar articles
Military & Aerospace Electronics
February 2007
John McHale
Thermal-management challenges highlight Military Technologies Conference 2007 U.S. Department of Defense and industry experts to discuss thermal and power management at the Military Technologies Conference (March 27 and 28, 2007) in Boston. mark for My Articles similar articles
Food Engineering
January 10, 2006
Air heat exchanger Air/air heat exchanger provides cooling and environmental protection in industrial enclosures requiring internal cabinet cooling using ambient air. mark for My Articles similar articles
Food Engineering
December 1, 2006
Kevin T. Higgins
Engineering R and D: Masters of heat transfer Jon Shaw, APV's development manager-heat exchangers, discusses the the company's re-engineered binary-drive plate heat exchanger. mark for My Articles similar articles
Military & Aerospace Electronics
March 2009
Keith Gurnett & Tom Adams
Up next: through-silicon vias The excitement over TSVs has been caused by the enhancement in process speed that can be gained by shortening distances. mark for My Articles similar articles
Military & Aerospace Electronics
February 2008
Nextreme Offers Electro-Optics and Microelectronics Cooler for Military Applications Nextreme Thermal Solutions is introducing the Ultra-High Packing Fraction (UPF) OptoCooler thermoelectric module for cooling and temperature-control requirements for electronics, medical, military, and aerospace applications. mark for My Articles similar articles
Military & Aerospace Electronics
April 2009
Tom Litrenta
Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50 Percent Early thermal simulations helped C-MAC MicroTechnology discovered that junction temperatures on a stacked module ranged up to 125 degrees and needed increased thermal resistance. mark for My Articles similar articles
Military & Aerospace Electronics
April 2008
Courtney E. Howard
Thermal Management a Challenge for Designers of Future Military Aircraft Today's aviation, vetronics, and other military-aero applications require more power, but have less space. This contributes to higher thermal loads and less opportunity to drive the heat out. mark for My Articles similar articles
CIO
March 1, 2003
Christopher Lindquist
Low-Heat Laptops You won't be able to use your laptop as a portable coffee warmer anymore, if technology from Sandia National Laboratories goes mainstream. mark for My Articles similar articles
The Motley Fool
October 30, 2006
Jack Uldrich
IBM to Chips: Cool It! Big Blue's new chip-cooling technique could keep Moore's Law on track. IBM's system, while not yet ready for commercial production, is reportedly so efficient that officials expect it will double cooling efficiency. mark for My Articles similar articles
Scientific American
August 2008
Mark Fischetti
Working Knowledge: Home Heating Pumps That Warm and Cool By extracting warmth and coolness from the outside air or ground, heat pumps can provide greater efficiency and lower cost over the long haul. mark for My Articles similar articles
IEEE Spectrum
November 2008
Monica Heger
IBM Tests Heating Homes With Data-Center Waste Heat Cooling computers with hot water is a step toward zero-emission data centers mark for My Articles similar articles
Food Engineering
June 1, 2008
Keeping Sugar's Cool RT Group's new heat exchanger cooled 80 tons per hour of sugar from 110 F to 86 F using cooling water at 68 F. mark for My Articles similar articles
Military & Aerospace Electronics
December 2006
John Keller
Demands for High Power and Optimum Size Drive Some Power-Supply Makers Away From Traditional COTS Solutions Moore's Law is placing a set of increasingly crushing demands on power-component makers who must feed the right amounts of electricity to the latest generations of microprocessor behemoths. mark for My Articles similar articles
Military & Aerospace Electronics
December 2007
John Keller
Cost-Sensitive Military Pressures Power Supply Makers to Shrink and Ruggedize COTS Devices Manufacturers of power electronics for military and aerospace applications say they are under pressure to shrink device size and keep a lid on prices, as well as to ruggedize and integrate off-the-shelf components. mark for My Articles similar articles
Military & Aerospace Electronics
April 2009
Carlo Gavazzi Introduces Rugged Air-Cooled Enclosures for Avionics and Vetronics Applications Carlo Gavazzi is introducing a series of re-circulating air-cooled rugged ATR enclosures for commercial off-the-shelf (COTS) printed circuit boards for extreme temperature, vibration, humidity, and contaminants. mark for My Articles similar articles
Food Processing
July 2010
New Food Rollout: July 2010 Yummy treats to help beat the heat. mark for My Articles similar articles
Food Engineering
June 7, 2007
All-welded exchanger Shell-and-tube heat exchangers for maximum pressure applications. mark for My Articles similar articles
Popular Mechanics
December 2008
Roy Berendsohn
How Your Heating System Works: A Primer Regardless of what prompts you to take a second look at your house's heating system, or perhaps the first look, you do need to be conversant with what makes it tick. Here are the basics. mark for My Articles similar articles
American Family Physician
June 1, 2005
James L. Glazer
Management of Heatstroke and Heat Exhaustion Heat exhaustion and heatstroke are part of a continuum of heat-related illness. Both are common and preventable conditions affecting diverse patients. mark for My Articles similar articles
Food Engineering
December 1, 2006
Kevin T. Higgins
Heat Transfer: advances, borrowed and new Technical improvements are occurring on several fronts, from heat exchangers, boilers and retorts to new-to-the-world pasteurizers. mark for My Articles similar articles
AboutSafety
December 5, 2001
What Is Heat Stress? Working or playing where it is hot puts stress on our body's cooling system. When the heat is combined with other stresses such as hard physical work, loss of fluids, fatigue or some medical conditions, it may lead to heat-related illness, disability and even death... mark for My Articles similar articles
Food Processing
March 2008
Mike Pehanich
Turning up the heat in thermal processing Energy costs are forcing innovations on the traditional cooking processes. mark for My Articles similar articles
Chemistry World
July 10, 2012
Coolant to put electric cars in the fast lane Battery temperature is critical for performance and safety, but it's a tricky business cooling the large batteries needed for electric vehicles. Now, scientists in Germany have developed a new coolant which promises to cool batteries on hot days. mark for My Articles similar articles
Military & Aerospace Electronics
October 2005
Overmolded Electronics Packaging Available for Licensing Officials of Delphi Corporation are offering their company's advanced overmolding technology to encase electronics assemblies for licensing. mark for My Articles similar articles
Food Engineering
November 1, 2006
Eye on Equipment in Powder and Bulk Material Handling Bin unloaders allow accurate discharging... high-temperature bulk powder cooling system... 180-degree rotation discharging system for drums of non-free powders... etc. mark for My Articles similar articles
Chemistry World
August 9, 2007
Kira Welter
Molecular Heatwave Spreads at Ferocious Pace Wildfires spread frighteningly fast, but thankfully not at kilometers per second pace. That's the rate at which heat rips through a molecule. mark for My Articles similar articles
AboutSafety
December 18, 2000
Heat In The Industrial Workplace Changes in both climatic conditions and industrial workplace practices have come to create greater heat- and fatigue-related problems than ever before. mark for My Articles similar articles
Military & Aerospace Electronics
November 2007
John McHale
Purdue Researchers Demonstrate New Chip-Cooling Technology Researchers are taking a new approach with a new technology that uses tiny ionic wind engines that they say might dramatically improve computer chip cooling-a constant challenge for military and commercial electronics designers. mark for My Articles similar articles