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Military & Aerospace Electronics February 2008 |
Nextreme Offers Electro-Optics and Microelectronics Cooler for Military Applications Nextreme Thermal Solutions is introducing the Ultra-High Packing Fraction (UPF) OptoCooler thermoelectric module for cooling and temperature-control requirements for electronics, medical, military, and aerospace applications. |
Military & Aerospace Electronics May 2008 Michael R. Palis |
Advances in thermal management techniques for chassis design A new approach to thermal management involves separating the ambient environment and the operating electronics to keep out contaminants. A convenient way to do this is using compact air-to-air heat exchangers. |
Military & Aerospace Electronics May 2007 John Keller |
Temperature's Rising: Designers Face Myriad Options to Cool Electronic Systems More electronic and electro-optic systems mean more electric power, and increasing heat that engineers must get rid of. Today's choices include convection, conduction, and liquid-cooling options. Tomorrow's choices will be more complex. |
Military & Aerospace Electronics May 2006 J.R. Wilson |
The great cooling dilemma: conduction, convection, or liquid Today's most advanced cooling technologies are starting to take center stage. |
Military & Aerospace Electronics June 2005 John McHale |
Purdue Researchers Create Miniature Cooling Device Mechanical engineers have developed techniques for modifying household refrigeration technology with small devices to cool future weapons systems and computer chips. |
Military & Aerospace Electronics May 2008 Courtney E. Howard |
Hot components and cool enclosures Systems architects and integrators are tackling the issues of military electronics survivability with clever chassis designs. |
Military & Aerospace Electronics May 2009 J.R. Wilson |
Electronic thermal management is heading to the wall Systems designers who are used to boosting electronic system performance by adding ever-more transistors may have to rethink their design approaches. |
Military & Aerospace Electronics April 2006 |
Heat Sinks for Low-Airflow Conditions Advanced Thermal Solutions has introduced maxiFLOW heat sinks for cooling ball grid arrays and other hot components in the restricted air flow conditions typical of today's condensed electronic packages. |
Military & Aerospace Electronics March 2006 |
Heat Sinks Deliver High Performance in Low-Airflow Conditions Advanced Thermal Solutions is offering maxiFLOW heat sinks for cooling ball grid arrays (BGAs) and other hot components in restricted air-flow conditions. |
Military & Aerospace Electronics July 2007 Ben Kuster |
CFD Analysis Delivers Impressive Savings for Electronics Thermal Design Computational-fluid-dynamics software is an invaluable thermal-analysis weapon for the electronics design arsenal. At VT Miltope Corp., it saves weeks of development time and thousands of development dollars-even on small projects. |
Military & Aerospace Electronics August 2006 John McHale |
Purdue Researchers Look at Nanotechnology to Reduce Computer-Chip Heating University researchers are looking to mitigate electronic systems heating problems through the use of carbon nanotubes. They have created carpets of microscopic nanotubes to enhance the performance of heat sinks to help keep future chips from overheating. |
Military & Aerospace Electronics July 2005 John Keller |
Is cooling the central design issue of our time? The pace of improvements in integrated circuitry is outstripping our ability to remove unwanted heat. And engineers are starting to quip about some of the dilemmas that new cooling approaches may create. |
The Motley Fool October 30, 2006 Jack Uldrich |
IBM to Chips: Cool It! Big Blue's new chip-cooling technique could keep Moore's Law on track. IBM's system, while not yet ready for commercial production, is reportedly so efficient that officials expect it will double cooling efficiency. |
IEEE Spectrum January 2009 Willie D. Jones |
Intel-led Team Demonstrates First Chip-Scale Thermoelectric Refrigerator An integrated thermoelectric device cools a hot spot on a much larger chip |
Military & Aerospace Electronics February 2007 John McHale |
Thermal-management challenges highlight Military Technologies Conference 2007 U.S. Department of Defense and industry experts to discuss thermal and power management at the Military Technologies Conference (March 27 and 28, 2007) in Boston. |
Military & Aerospace Electronics September 2005 Ram Rajan |
Solving thermal-management challenges in military and aerospace applications Higher system performance -- often coupled with faster and hotter processors, and denser packaging -- can be two major nemeses for the chassis designer. |
Military & Aerospace Electronics January 2006 Randy Banton |
Evolving COTS cooling for military environments A new 6U infrastructure for air cooling and conduction cooling which is extensible to 3U systems, spray-cooling and liquid-flow-through cooling systems, will enable broader use of commercial off-the-shelf systems. |
Military & Aerospace Electronics April 2008 Courtney E. Howard |
Thermal Management a Challenge for Designers of Future Military Aircraft Today's aviation, vetronics, and other military-aero applications require more power, but have less space. This contributes to higher thermal loads and less opportunity to drive the heat out. |
PC Magazine May 31, 2006 Sebastian Rupley |
A Puny Pump The arrays of fans and heat sinks that cool today's computer chips are headed for extinction if researchers at Purdue University get their way... New Babybot behaves like a 2-year-old... |
Military & Aerospace Electronics July 2009 |
Parker Offers Liquid Cooling for High-Power Electronic Thermal Management Parker Hannifin is introducing a two-phase liquid cooling system for electronic thermal management and heat removal from high-power electronics. |
IEEE Spectrum November 2008 Monica Heger |
IBM Tests Heating Homes With Data-Center Waste Heat Cooling computers with hot water is a step toward zero-emission data centers |
This Old House November 2007 Max Alexander |
Geothermal Heat Pump For the ultimate in comfort and energy conservation, start by digging a hole. |
IEEE Spectrum June 2011 Eliza Strickland |
Thermoelectrics Get Cooler Start-ups are advancing solid-state cooling systems |
CIO March 1, 2003 Christopher Lindquist |
Low-Heat Laptops You won't be able to use your laptop as a portable coffee warmer anymore, if technology from Sandia National Laboratories goes mainstream. |
Military & Aerospace Electronics April 2008 Courtney E. Howard |
Thermal Management Targets the Enemy of Electronics: Excessive Heat Heat threatens the longevity and performance of electronics, especially vehicular electronics (vetronics), in military-aero environments. |
Military & Aerospace Electronics December 2006 John Keller |
Demands for High Power and Optimum Size Drive Some Power-Supply Makers Away From Traditional COTS Solutions Moore's Law is placing a set of increasingly crushing demands on power-component makers who must feed the right amounts of electricity to the latest generations of microprocessor behemoths. |
InternetNews July 7, 2010 |
IBM Testing Hot Water to Cool Servers IBM researchers in Switzerland are standing server cooling on its head, using water as warm as 140 degrees to cool processors that have an unusually high safe operating temperature. |
Military & Aerospace Electronics November 2007 John McHale |
Purdue Researchers Demonstrate New Chip-Cooling Technology Researchers are taking a new approach with a new technology that uses tiny ionic wind engines that they say might dramatically improve computer chip cooling-a constant challenge for military and commercial electronics designers. |
InternetNews August 15, 2007 Andy Patrizio |
A Mighty Wind's a Blowin' at Purdue Researchers at Purdue University have developed a new method of semiconductor cooling that could improve the cooling rate inside computers by as much as 250 percent. |
PC Magazine December 25, 2007 Loyd Case |
Keeping Cool Whenever you stuff a PC into a tiny space without adequate ventilation, heat can become a problem. |
Military & Aerospace Electronics April 2009 Courtney E. Howard |
Thinking Inside the Box Systems engineers and technology firms partner to equip mil-aero platforms with innovative enclosures, backplanes, and electronics packaging. |
Military & Aerospace Electronics May 2007 John Keller |
Through with Hydraulics? Think Again Opportunity for leaks, outright breaks, clogs, and the weight of liquid and pipe have led aircraft designers to search for a way to eliminate hydraulic systems. Electric systems looked promising, but now it's back to the drawing board. |
BusinessWeek October 4, 2004 Stephen H. Wildstrom |
Those Superfast Chips: Too Darn Hot Cooling today's fastest chips is becoming a challenge in even the biggest desktop towers. |
CIO January 1, 2007 Robert Mullins |
Throw Cold Water on Data Center Costs IBM will license its technology for cooling servers with water instead of air to Panduit, a global networking and electrical manufacturer, hoping to encourage adoption of IBM energy-saving techniques for data centers. |
Military & Aerospace Electronics December 2005 Powers & Penglase |
Using DC-DC Converters in Mobile-Based Ground Equipment As designers incorporate increasing amounts of sophisticated electronics into industrial and military vehicle-based applications, high-density DC-DC converters have evolved to keep pace. |
Military & Aerospace Electronics April 2009 Tom Litrenta |
Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50 Percent Early thermal simulations helped C-MAC MicroTechnology discovered that junction temperatures on a stacked module ranged up to 125 degrees and needed increased thermal resistance. |
Popular Mechanics February 2007 Joel Johnson |
How to Cool Down Your Computer: Tech Clinic Leaving the case open while you run your computer draws more bugs in dust and outweighs any cooling benefits. |
Food Engineering January 10, 2006 |
Air heat exchanger Air/air heat exchanger provides cooling and environmental protection in industrial enclosures requiring internal cabinet cooling using ambient air. |
Fast Company Daniel Terdiman |
IBM: Data Centers Could Cool Themselves With Their Own Waste Heat The centers, which use tremendous amounts of energy, will become far more efficient if "waste heat" generated by churning data centers can be converted into cool air. |
Chemistry World July 10, 2012 |
Coolant to put electric cars in the fast lane Battery temperature is critical for performance and safety, but it's a tricky business cooling the large batteries needed for electric vehicles. Now, scientists in Germany have developed a new coolant which promises to cool batteries on hot days. |
InternetNews October 20, 2006 Drew Robb |
Storage Turns Power Hungry The growing demand for storage capacity has brought with it power and cooling issues. |
Military & Aerospace Electronics April 2008 |
Elma Offers 1U Microbox as an Integrated Solution The 19-inch rackmount MicroBox features as many as 10 modules (mid-size, single width), which includes 6 AMCs, a Power Module (PM), and a J-TAG Switch Module (JSM) from MicroBlade, and 1 MicroTCA Carrier Hub (MCH). |
CIO April 15, 2006 Susannah Patton |
Powering Down Electricity-hungry equipment, combined with rising energy prices, are devouring data center budgets. Here's what you can do to get costs under control. |
InternetNews July 25, 2007 David Needle |
HP's Green Data Center Portfolio Keeps Growing HP introduced Thermal Zone Mapping, a new technology designed to identify trouble spots in the data center in terms of energy efficiency. |
PC World July 2006 Eric Dahl |
Faster Dual-Core Processors Both AMD and Intel launch new processors... Business notebooks go wide screen... Wi-Fi gets tiny... Better CPU cooling... |
InternetNews June 10, 2009 Andy Patrizio |
HP's 'Extreme' Datacenter Products New, more efficient, hardware and services are tuned for the most massive of datacenters, where scale has an impact in more ways than one. |
InternetNews November 25, 2009 |
Europe Jumps Into HPC Fray With Aurora A company known for wearable PCs comes out with its own supercomputer design. What does it have that IBM and HP doesn't? |
Military & Aerospace Electronics October 2005 |
Method of heat removal is critical in design Far too often cooling is an afterthought in the design of the latest "black box" and by the time it is parameters such as power, volume, and weight are all at a premium. |
PC Magazine March 7, 2008 Loyd Case |
The Coolest Install two cooling fans in your PC. |
Bank Technology News April 2010 Shanker Ramamurthy |
Why a Green Datacenter Makes Dollars And Sense With data centers using ten to 30 times more energy per square foot than office space and data center energy use doubling every five years, energy efficiency is becoming a key metric of IT operational effectiveness. |