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Military & Aerospace Electronics
January 2008
Chris Reynolds |
Tin-Lead Components Alive and Well in the Military Sector Contrary to popular opinion, tin-lead termination devices are alive and well, and many devices are readily available from stock.   |
National Defense
September 2009
Jean & Erwin |
Higher Prices and More Failures Predicted for Defense Electronics All electronics from Europe are required to be made with lead-free solder. However, U.S. defense and aerospace users have documented over $1 billion of damage resulting from failure of the lead-free electronics. |
Military & Aerospace Electronics
August 2006
Courtney E. Howard |
Electronics Designers Grapple with Lead-Free Solder Guidelines The European Union WEEE/RoHS directives cause concern in the military and aerospace market as to the availability and reliability of lead-free electronic components. |
Military & Aerospace Electronics
April 2009
J.R. Wilson |
Lead-Free RoHS on Military Electronics Procurement Worldwide environmental requirements to use lead-free solder continues to squeeze military system designers. |
Military & Aerospace Electronics
July 2005
Gurnett & Adams |
Lead-free processing involves several board issues As worldwide electronics manufacturing moves slowly and unevenly into lead-free materials and processes, board assemblers should pay attention to six areas of potential problems. |
Military & Aerospace Electronics
October 2005
John Keller |
Lead-Free Solder: A Train Wreck in the Making Companies are walking away from leaded solders because they see their economic futures elsewhere, driven primarily by the European program to limit the use of lead. Where this trend places the military, at least in the short term, is in a lot of trouble. |
Military & Aerospace Electronics
October 2007
Gurnett & Adams |
The danger of hybrid-solder boards If a hybrid board fails in military or aerospace applications, the consequences could be severe. |
Military & Aerospace Electronics
July 2006
John Keller |
Could RoHS Mean the End of COTS as we Know it? The electronics industry's move away from using solders containing lead is setting up a clash between private industry, both here and in Europe, and the U.S. military that may well lead to the end of the COTS era as we have come to know it. |
Military & Aerospace Electronics
August 2008
Tom Adams |
Revised moisture sensitivity standard includes lead-free components The revised standard, J-STD-020D, is used by component manufacturers to expose a given component type to a specific temperature/humidity environment and then test the component. |
Military & Aerospace Electronics
December 2004 |
Lead-Free Movement Complicates Electronic Parts Traceability Electronics manufacturers at all levels are increasingly concerned with the implications of lead-free processing. The real challenge in military applications will be to ensure that all components are clearly identified at all stages as lead or lead-free. |
Military & Aerospace Electronics
December 2008
Tom Adams |
Standard Gives Guidance for Alloy Conversion Using Hot-Solder Dip Military and aerospace received allowance to continue to use lead solder. However, the elimination of lead soldered components by electronics companies has left the military and aerospace unable to buy components on the market. |
Military & Aerospace Electronics
August 2007
Courtney E. Howard |
The Cost of Compliance: A RoHS Retrospective The military and aerospace industry continues to grapple with lead-free challenges a year after the European Union restricts the use of hazardous substances. |
Military & Aerospace Electronics
January 2007
John McHale |
Lead-Free Evaluation and Protocol in Lineup for 2007 Military Technologies Conference Department of Defense (DOD) and industry experts will discuss procedures and methods for dealing with lead-free compliance. |
Military & Aerospace Electronics
October 2005
Gurnett & Adams |
Can ISO Standards Smooth the Lead-Free Transition? In the long run, the global legislative demand being made by lead-free rules and the European Reduction of Hazardous Substances rule in the consumer world will benefit military and aerospace users. |
Military & Aerospace Electronics
May 2007
John Keller |
GEIA Lead-Free-Solder Guidelines to be Released by Early 2008 Raytheon, working under the auspices of the Government Electronics Industries Association (GEIA), will release its guidelines on performance and qualification testing for lead-free solder during the first quarter of 2008 |
Military & Aerospace Electronics
July 2007
Keith Gurnett & Tom Adams |
RoHS One Year Later: Supplies of Leaded Solder Drying up When the EU's Restriction of Hazardous Substances legislation took effect one year ago, it marked the beginning of the end for most electronics assemblies containing leaded solder, and the beginning of a nearly universal franchise for lead-free solders. |
Military & Aerospace Electronics
December 2005 |
Letters to the Editor Tin-whisker issues deserve to be on the front burner... No-lead solder problems continue to plague industry... |
Military & Aerospace Electronics
April 2008
Courtney E. Howard |
Lead-Free Issues Continue to Plague Mil-Aero Market, Says DMEA Engineer The lead-free movement has a greater impact on the U.S. Department of Defense (DOD) than the commercial market. |
Military & Aerospace Electronics
October 2004 |
The move to lead-free solders has its own challenges and hidden problems Peak reflow temperature increases and the imperfectly known characteristics of new materials lie at the core of the problem. Will the new finish layer on the lead frame adhere well to the epoxy? Will the epoxy stick to the die face? |
InternetNews
April 9, 2004
Michael Singer |
Chipmakers Going Lead-Free Intel, AMD and National Semiconductor begin a drive to reduce the heavy metal content on their chips by as much as 95 percent. |
Military & Aerospace Electronics
August 2007
Courtney E. Howard |
Industry Wants Unique Part Numbers for Lead-Free BGAs The electronics industry is calling for unique part numbers to differentiate lead-free ball-grid-array (BGA) metallurgies that comply with the European Union's Restriction on Hazardous Substances (RoHS) directive. |
Chemistry World
August 20, 2009
Lewis Brindley |
New nanoboxes take shape US researchers have made nano-sized boxes from nickel and tin - marking the first time that patterned 3D structures have been built on the nanoscale. |
