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Military & Aerospace Electronics October 2009 Adams & Gurnett	The Coming CMOS Imaging Revolution CMOS image sensors (common in video and digital cameras) are undergoing a qualitative change that will provide a stunning range of new products for consumers, as well as for military and aerospace users.
Military & Aerospace Electronics March 2009 Keith Gurnett & Tom Adams	Up next: through-silicon vias The excitement over TSVs has been caused by the enhancement in process speed that can be gained by shortening distances.
IEEE Spectrum February 2005 Singh & Thakur	Chip Making's Singular Future Beleaguered chip makers are counting on single-wafer manufacturing, which makes ICs on one wafer at a time, to cut costs and get chips to market faster.
IEEE Spectrum March 2013 Joachim N. Burghartz	Make Way for Flexible Silicon Chips We need them because thin, pliable organic semiconductors are too slow to serve in tomorrow's chips. Seamless integration of computing into everyday objects isn't quite here yet.
Military & Aerospace Electronics March 2005 Tom Adams	The shrinking-package approach to low-cost, robust sensor arrays One potential benefit of shrinking the sizes of microelectronics components is the potential to scatter a large number of sensors arranged as a distributed array over an area for surveillance.
Military & Aerospace Electronics April 2007 Gurnett & Adams	Merging the Functionalities of Silicon, and III-Vs: Two Promising Approaches One of the least flexible rules in electronic design is the need to keep silicon devices, and compound semiconductor devices separate. Two new developments are now threatening to make this rule partly or entirely obsolete.
IEEE Spectrum March 2011 Apte et al.	Advanced Chip Packaging Satisfies Smartphone Needs Clever chip packaging means mobile devices can be smaller and smarter
Military & Aerospace Electronics December 2006 Gurnett & Adams	Taming the Gallium Arsenide Dicing Process A 2-inch gallium nitride wafer puts a thin film of GaN on a diamond base. One application: high-power, high-frequency power amplifiers.
Military & Aerospace Electronics June 2006 Gurnett & Adams	Copper-post technology shows promise for cooling in military applications The change from solder bumps to copper posts has far-reaching implications for advanced electronics in military and aerospace applications.
Industrial Physicist Feb/Mar 2003 Eric Lerner	Briefs Hidden imaging data... Piggy-back chips... Synthetic ion pump... Strong, ductile copper
IEEE Spectrum January 2012 Rachel Courtland	3-D Chips Grow Up In 2012, 3-D chips will help extend Moore's Law - and move beyond it.
Military & Aerospace Electronics March 2010 John Keller	Multisensor Designs and Increasing Resolutions Are Major Trends in Infrared and Other Electro-Optical Sensors Infrared (IR) and other electro-optical sensors will see major technological breakthroughs in sensitivity, resolution, and overall ability to help military forces see through fog, smoke, dust, and the darkness of night.
IEEE Spectrum October 2006 Brian R. Santo	Acronym Addiction When you live on the cutting edge of technology, there are, literally, no words to describe it. Instead we have acronyms. Lots and lots of acronyms. ABT... BEOL... CSP... etc.
Military & Aerospace Electronics April 2008	DARPA Looks to Sensors Unlimited to Develop Next-Generation Night-Vision Technology The night-vision sensor technology will be for helmet-mounted and micro vehicle applications.
Military & Aerospace Electronics February 2008 Courtney E. Howard	Princeton Lightwave Contributes Technology to 3d Imaging Laser Radar System Engineers at Princeton Lightwave are developing focal plane arrays (FPAs) for use in three-dimensional (3D) imaging flash laser radar (ladar) systems for military applications.
IEEE Spectrum March 2007 Mouli & Carriker	Future Fab If a billion transistors on a postage-stamp-size chip impress you, consider the fabrication facilities that put them there. How software is helping Intel go nano -- and beyond.
The Motley Fool March 15, 2006 Dan Bloom	Probing Into FormFactor FormFactor's advanced probe cards help semiconductor manufacturers cut costs. The stock market has certainly noticed FormFactor's performance and potential.
IndustryWeek December 1, 2004 Tim Stevens	Technologies Of The Year -- IBM Corp.'s Nanotechnology For Semiconductor Processing Polymer molecules that self-assemble will enable smaller, more powerful semiconductor devices for the future. The technology promises significantly reduced feature size, higher component density, improved performance and lower voltage requirements for microelectronic devices.
Technology Research News March 26, 2003	Tilted trenches turn out tiny wires Researchers from UCLA, UCSB, and Cal Tech have found a way to make arrays of closely-spaced and crossed metal and semiconductor nanowires.
Industrial Physicist Rubin & Poate	Ion implantation in silicon technology Ion implanters are essential to modern integrated-circuit (IC) manufacturing. Doping or otherwise modifying silicon and other semiconductor wafers relies on the technology.
Technology Research News August 10, 2005 Eric Smalley	Ice transforms chipmaking Spraying water vapor onto cold silicon could be a simple way to make computer chips. The key is etching nanoscale lines into the resulting ice to make microscopic computer circuits. The process is environmentally friendly to boot.
Industrial Physicist Aug/Sep 2004	New Products Torque flange... Luminance Detector... High-Speed Camera... Pressure Gauge... Laser Diode... Illumination Source... Wafer-Dicing System... etc.
Chemistry World June 1, 2010 Simon Hadlington	Structural order gained over conducting polymer Scientists in Canada and the US have shown how it is possible to assemble ordered arrays of short chains of a commercially important conducting polymer on a metal surface.
Military & Aerospace Electronics January 2008	Salvador Imaging to Develop Color Night-Vision Camera for Army Future Combat System Salvador Imaging will develop a night-vision camera capable of providing color, night-vision imagery for FCS unmanned ground vehicle systems, under contract terms with Lockheed Martin Missile and Fire Control
The Motley Fool June 13, 2006 Dan Bloom	Texas Instruments Gets Tinier The company finds a watery way to create smaller, faster, cheaper chips.
InternetNews June 12, 2009 Andy Patrizio	Gartner: Cloud, New Chip Tech May Spur Rebound What will cloud computing and 3D chip manufacturing do for the industry? Quite a bit.
Chemistry World August 8, 2013 Anthony King	Diamond encrusted nano-saw to slash silicon waste Scientists at Fraunhofer in Germany and CSIRO in Australia have teamed up to make an ultra-thin saw made of carbon nanotubes sprinkled with diamonds. Their new nano-saw promises to slice thinner silicon wafers.
The Motley Fool July 12, 2006 Dan Bloom	Semiconductor Growth Is Slowing Despite the prevalence of consumer electronics devices, sales growth has slowed dramatically since the '70s. The slowing growth rate of semiconductor chips should have investors rethinking how they should value and invest in this industry.
Reactive Reports Issue 49 David Bradley	Hydrophobic Water? Researchers have found evidence to indicate that water molecules don't always want to bond to other water molecules, affecting the uniformity of water forming on metal surfaces.
Chemistry World September 4, 2014 Debbie Houghton	Waste office paper comes to a sticky end A process for generating aluminium -- aluminium bonding adhesives from waste office paper could give a purpose to paper than can no longer be recycled into more paper.
IEEE Spectrum May 2007 Tekla S. Perry	Medal of Honor: Thomas Kailath A professor emeritus at Stanford University, Kailath's algorithms re-engineered digital communications and semiconductor processing
IndustryWeek November 1, 2003 Traci Purdum	Bigger, Better, Faster Intel Corp. converts 200-mm wafer factory in Chandler, Ariz. The result: increased productivity.
Chemistry World May 28, 2015 Cesar Palmero	Gecko-inspired adhesives for microfluidics Scientists from Canada report an affordable manufacturing advance in microfluidics with a dry adhesive system that demonstrates strong, self-healing and reversible bonding.
Military & Aerospace Electronics May 2007	Silicon Wafer Shipments Experience Growth for the Fifth Consecutive Year Worldwide silicon wafer area shipments increased by 20 percent in 2006 when compared to 2005 area shipments according to the SEMI Silicon Manufacturers Group (SMG).
Chemistry World January 29, 2015 Santiago Alvarez	What we mean when we talk about bonds The chemical bond is still a matter of lively debate among chemists, even a century after Gilbert Lewis introduced his electron pair bonding concept.