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Military & Aerospace Electronics
April 2006
Gurnett & Adams |
A Military and Aerospace Future for Board-Embedded Chips? There are as yet no distinctly military or aerospace applications for embedded chips, but the advantages that these structures provide are so compelling that their use in military applications seems inevitable within a few years.   |
Military & Aerospace Electronics
November 2006
Gurnett & Adams |
Blazing speed is the goal of embedded passives The real purpose of 3-D integration is higher speed and better performance, not merely shrinkage of the physical dimensions. |
Military & Aerospace Electronics
June 2006
Gurnett & Adams |
Copper-post technology shows promise for cooling in military applications The change from solder bumps to copper posts has far-reaching implications for advanced electronics in military and aerospace applications. |
Military & Aerospace Electronics
March 2005
Tom Adams |
The shrinking-package approach to low-cost, robust sensor arrays One potential benefit of shrinking the sizes of microelectronics components is the potential to scatter a large number of sensors arranged as a distributed array over an area for surveillance. |
IEEE Spectrum
June 2006
Rao R. Tummala |
Moore's Law Meets Its Match By 2010, the "More Than Moore's Law" movement -- which focuses on system integration rather than transistor density -- will lead to revolutionary megafunction electronics. |
Military & Aerospace Electronics
October 2007
Gurnett & Adams |
The danger of hybrid-solder boards If a hybrid board fails in military or aerospace applications, the consequences could be severe. |
Military & Aerospace Electronics
October 2004 |
The move to lead-free solders has its own challenges and hidden problems Peak reflow temperature increases and the imperfectly known characteristics of new materials lie at the core of the problem. Will the new finish layer on the lead frame adhere well to the epoxy? Will the epoxy stick to the die face? |
Military & Aerospace Electronics
December 2004 |
Lead-Free Movement Complicates Electronic Parts Traceability Electronics manufacturers at all levels are increasingly concerned with the implications of lead-free processing. The real challenge in military applications will be to ensure that all components are clearly identified at all stages as lead or lead-free. |
National Defense
September 2009
Jean & Erwin |
Higher Prices and More Failures Predicted for Defense Electronics All electronics from Europe are required to be made with lead-free solder. However, U.S. defense and aerospace users have documented over $1 billion of damage resulting from failure of the lead-free electronics. |
Military & Aerospace Electronics
July 2005
Gurnett & Adams |
Lead-free processing involves several board issues As worldwide electronics manufacturing moves slowly and unevenly into lead-free materials and processes, board assemblers should pay attention to six areas of potential problems. |
IEEE Spectrum
March 2011
Apte et al. |
Advanced Chip Packaging Satisfies Smartphone Needs Clever chip packaging means mobile devices can be smaller and smarter |
Military & Aerospace Electronics
August 2008
Tom Adams |
Revised moisture sensitivity standard includes lead-free components The revised standard, J-STD-020D, is used by component manufacturers to expose a given component type to a specific temperature/humidity environment and then test the component. |
Military & Aerospace Electronics
August 2006
Courtney E. Howard |
Electronics Designers Grapple with Lead-Free Solder Guidelines The European Union WEEE/RoHS directives cause concern in the military and aerospace market as to the availability and reliability of lead-free electronic components. |
IEEE Spectrum
April 2010
James Turner |
Build a Custom-Printed Circuit Board PCBs aren't so hard to make and needn't break the bank |
Military & Aerospace Electronics
February 2007
Zulki Khan |
Designing robust circuit-board products for military and aerospace applications There are several key design and layout considerations to make military and aerospace PCBs more robust. |
Military & Aerospace Electronics
January 2007
John McHale |
Lead-Free Evaluation and Protocol in Lineup for 2007 Military Technologies Conference Department of Defense (DOD) and industry experts will discuss procedures and methods for dealing with lead-free compliance. |
IEEE Spectrum
May 2006
Pecht & Tiku |
Bogus! Electronic manufacturing and consumers confront a rising tide of counterfeit electronics. Feeding this problem is the shift of manufacturing to China, the growing sophistication of technology, and the rise of the Internet as a marketplace. |
Military & Aerospace Electronics
July 2006
John Keller |
Could RoHS Mean the End of COTS as we Know it? The electronics industry's move away from using solders containing lead is setting up a clash between private industry, both here and in Europe, and the U.S. military that may well lead to the end of the COTS era as we have come to know it. |
Military & Aerospace Electronics
December 2008
Tom Adams |
Standard Gives Guidance for Alloy Conversion Using Hot-Solder Dip Military and aerospace received allowance to continue to use lead solder. However, the elimination of lead soldered components by electronics companies has left the military and aerospace unable to buy components on the market. |
Military & Aerospace Electronics
April 2009
J.R. Wilson |
Lead-Free RoHS on Military Electronics Procurement Worldwide environmental requirements to use lead-free solder continues to squeeze military system designers. |
Military & Aerospace Electronics
July 2007
Keith Gurnett & Tom Adams |
RoHS One Year Later: Supplies of Leaded Solder Drying up When the EU's Restriction of Hazardous Substances legislation took effect one year ago, it marked the beginning of the end for most electronics assemblies containing leaded solder, and the beginning of a nearly universal franchise for lead-free solders. |
Military & Aerospace Electronics
May 2007
John Keller |
GEIA Lead-Free-Solder Guidelines to be Released by Early 2008 Raytheon, working under the auspices of the Government Electronics Industries Association (GEIA), will release its guidelines on performance and qualification testing for lead-free solder during the first quarter of 2008 |
IEEE Spectrum
August 2007
Paul Wallich |
Deeply Superficial Hackers must develop new tricks to modify the guts of today's surface-mount hardware. |
Military & Aerospace Electronics
April 2008
Courtney E. Howard |
Lead-Free Issues Continue to Plague Mil-Aero Market, Says DMEA Engineer The lead-free movement has a greater impact on the U.S. Department of Defense (DOD) than the commercial market. |
InternetNews
April 9, 2004
Michael Singer |
Chipmakers Going Lead-Free Intel, AMD and National Semiconductor begin a drive to reduce the heavy metal content on their chips by as much as 95 percent. |
